Solve trade-off problems such as temperature, size, EMC, and noise with multi-objective optimization!
We will introduce examples of thermal design and thermal design consulting.
In thermal design, there are many challenges such as cooling of heat-generating components and cost reduction. However, trade-off issues related to temperature, size, EMC, and noise can be resolved through multi-objective optimization.
Therefore, we propose the multi-objective robust design optimization support tool 'modeFRONTIER' and the thermal design support tool 'FloTHERM' specifically for electronic devices.
By utilizing the "FloTHERM node" in modeFRONTIER, complex settings and operations are unnecessary, allowing for easy optimization. Furthermore, simultaneous execution of multiple jobs is possible, which can shorten the time required for calculations.
[Case Study]
■ Challenge: Trade-off issues related to temperature, size, EMC, and noise
■ Proposed Products: Multi-objective robust design optimization support tool "modeFRONTIER"
Thermal design support tool for electronic devices "FloTHERM"
■ Benefits: No need for complex settings or operations, easy optimization
*For more details, please refer to the PDF document or feel free to contact us.